AMD is studying photonic technology to transmit data between chips at the speed of light

amd show interest in photonic technology And how will that benefit the company’s multi-layered chips. And it is that, thanks to photonics, incredibly fast data communication can be achieved. In fact we are talking transmit data between chips at the speed of light,

can be understood as a means of transmitting information using photonic technology applied to hardware photons of lightIt uses the transformation relative to the current form of the transfer. electronsso we have one speed too high The use of photons and it is a technology that can be very useful to improve the intercommunication between chips. AMD thought of it that way, because they plan to use it to improve data transmission between different chips, to improve consumption, Delay You performanceamong others.

AMD already filed a patent in 2020 for a supercomputer with photonic technology

AMD filed a patent two years ago United States Patent Office Show the use of this technique. is considered one of supervisor Which could enable photonics-based communication systems connected to a single chip. However, all of this was not produced in practice and remained as a written prototype. However, this shows AMD’s interest in this technology and it is not for less, since it will allow strong innovation in communication between systems. chipotle,

We can say that photonics started a long time ago 1960sfor the purpose of using light waves perform Tasks similar For those ElectronicAnd it is that if successful, we have the advantage that the data is transmitted at the speed of light, and in turn we use light as a medium, rather than metals In the form of copperSo if AMD can use this technology in their chips, Power consumption and latency will be reduced and moreover, if Will increase performance and scalability,

AMD’s patent document was published less than a month ago, on June 30. After using it 2 years after its introduction, we can observe the design and operation of AMD technology. In order not to go into too much detail, here we leave a summary that explains what this technique consists of:

Manufacture of capable semiconductor chip packages fiber optic connection a. includes preparation Integrated photonic circuits Engraving of a V-shaped groove in the fiber mating area at the front; Combination of photonic integrated circuits with organic redistribution; etching the organic redistribution layer of biological redistribution; and attaching an optical fiber to the front face fiber coupling area.

This is an AMD patent applied to semiconductors.

We see in said document diagrams with numbers and parts that if we break them down we have:

  • 100 – semiconductor chip package.
  • 105 – System on a chip (community,
  • 110 – photonic chip
  • 120 – Connected fiber optic cable
  • 130 – Mold Compound
  • 135 – Single wafer substrate
  • 140 – biological redistribution layer (ORDL,
  • 145 – Microedges that attach the SoC (105) and photonic chip (110) to the ORDL (140)
  • 150 – Tenacity
  • 155 – Bottom Fill
  • 160 – Ball Grid (BGAs) Standard

Unfortunately, for the application of this AMD technology, the redistribution layers between the chips must be organic (ORDL). However, the current of metalwho distributes I/O access in different parts of the chip, the same technology tsv of TSMCThat said, we have biological technologies like screens OLED current use organic component To produce light when they respond to electrical stimulation.

However, it is unlikely that we will see AMD using this technology in the future. At least in the consumer sector, because it costs too much for its daily use. More and more, we will see it in performing areas where its use is essential.

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