Xiaochun Li Receives Prestigious ASME Honor in Mechanical Engineering for Contributions to Manufacturing Technology

Professor of Mechanical and Aerospace Engineering at UCLA Xiao Chun Li moved back 2022 William T. Ennor Manufacturing Technology Award from the American Society of Mechanical Engineers (ASME) for “significant contributions to the solidification processing, scalable manufacturing, and successful commercialization of nanoparticle-reinforced metal matrix composites”.

Established in 1990 by the company’s Production Engineering Division (now known as the Manufacturing Engineering Division) in conjunction with Alcoa Corporation, the ASME award recognizes individuals who have developed or contributed significantly to “an innovative manufacturing technology, the implementation of which has resulted in substantial economic and/or societal benefits.

Li, who holds the Raytheon Endowed Chair in Manufacturing Engineering, also has a cross-appointment to the Department of Materials Science and Engineering at the UCLA Samueli School of Engineering. He leads the SciFacturing Laboratory which adopts a scientific approach in its theoretical and experimental research. His work has uncovered how nanoparticles disperse in molten metals and helped explain nanoparticle-metal interactions, the precise control of material microstructures, and the characterization of material properties. The lab has also developed scalable processes for commercial production.

In addition, Li has also developed new materials manufacturing processes, such as improvements in nanoparticles melting and solidificationas well as the creation of new technology-enhanced materials, such as versatile aluminum alloys, lighter high performance metals and tougher glasses.

Li’s groundbreaking achievements have earned him many accolades, including his election as a member of the NaAssociation of Inventors, ASME and the International Society for Nanofabrication.

Previous 2D Cations in Tin-Lead Perovskite Solar Cells Increase Conversion Efficiency to 25.5%
Next Chinese University of Hong Kong gets boost for biomedical tech R&D - OpenGov Asia